In addition, the machine pointed out that its SimmTech chip size flip chip package carrier (FC-CSP) with the arrival of low-cost smart phone era, cost-effective, also won the favor of customers, next year's growth is still optimistic. In addition, although the silver production of this year is somewhat deferred, it is expected to start shipping in the first half of next year.
In the first three quarters of this year, the revenue share of memory-related products has dropped to 20~25%, the packaging and testing materials accounted for 35%, the carrier disk and rolling bar driver IC accounted for 20%, and others (mainly 10% of the LED lead frame).
Regarding the kinetic energy of each product line next year, the machine pointed out that in addition to the LED lead frame and FC-CSP kinetic energy, overall, the sealing and testing materials are relatively stable. The legal person estimates that compared with this year, the profit machine will be expected to maintain a moderate growth of 10% next year.
On the recent IC packaging and testing plant, the ASE, Kaohsiung K7 factory part of the production line was shut down, the machine said that ASE has joined the ranks of pulling goods in recent years, is the important reason for the machine to test materials can still rise year by year, but the machine seal The customer who measured the materials was still scattered, and the production line where ASE was stopped was not a supplier, so it did not have an impact on the operation.
Industry insiders have observed that some production lines stopped by the Kyocera K7 plant should last for 2 to 3 months. Therefore, whether the transfer effect will occur in the future may have to be confirmed by Q1 next year.
Panasonic provides extremely dependable electronics assembly equipment in the areas of SMT (surface mount technology), PTH (pin through-hole), and processes involving microelectronics back-end packaging of any-mix circuit manufacturing. We offer first-class equipment ranging from screen printers and dispensing, through component placement and inspection, up to axial and radial insertion, die bonding, die attach and flip chip. Our equipment is used all around the world to enable the production of the most modern technology.
Our variable machines in modular format support a large range of technologies and, from the installation of just one machine through to assemblies of over 1,000, can take care of processes such as, COB (chip on board), SOP (system on package), epoxy die attach, POP (package on package), 3D packaging, TS (thermo-sonic) and TC (thermo-compression) processing, plasma RIE surface cleaning, plasma ICP etching, and thin wafer plasma dicing. To perform odd-form placement and end-of-line work, we also offer automated equipment.
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Shenzhen Keith Electronic Equipment Co., Ltd. , https://www.aismtks.com