Electronic enthusiasts in October "hot touch technology special issue" hot download, how can you lack!
In order to increase the added value of their Ultrabook products, notebook brands are competing to develop models that combine deformation concepts and narrow bezel designs, resulting in increased OGS panel strength challenges. Therefore, OGS panel manufacturers are borrowing heavy physical and chemical secondary strengthening processes, and Overcome the related defects and problems derived from secondary strengthening to enhance the strength of OGS panels.
With the advent of the Windows 8 operating system, the industry has carefully observed whether this innovative software with touch interaction as its core has the opportunity to set off a new wave of consumer electronics demand. Especially in the application field of stylus pens, the current stylus pens developed by various manufacturers are all based on the concept of wide visual effect design equipped with a thin and light, detachable flat screen, metal ultra-thin shell, and narrow bezel screen. The trend of the first generation of touch laptops is mainstream.
However, despite the obvious design and difference of the new concept touch pens, high sales prices have become the development resistance of the recession era. In order to drive down costs, various brands have almost focused on the development of pen components. In terms of production cost, OGS touch products have become the first choice for touch notebooks today.
Driven by the improved yield of highly full-plane bonding technology and driven by the Windows 8 operating system, the market demand for consumer touch electronic products has gradually emerged. OGS touch panel business opportunities have erupted in the second half of 2012, regardless of the size of large, medium and small screens All mobile devices have used OGS in a large number of products, but the key point for OGS panel manufacturers to profit is to reduce the production cost of OGS modules, simplify the number of production process stations and introduce low-cost material components.
In addition, as Apple (Apple) uses in-cell (In-cell) (Figure 1) touch technology on iPhone5 products, high-end smart phone products are all scrambling to follow up, making the touch panel market war heated up ( Table 1), including thin-film transistor liquid crystal display (TFTLCD) panel manufacturers (such as AUO, Innolux and Huaying) are also actively grabbing the touch business opportunities.
Figure 1 In-cellPixelDesign schematic diagram and panel cross-sectional diagram description
In-cell technology has the advantages of light and thin, high light transmittance and power saving. However, yellow light technology has a high threshold, so Apple chose In-cell to distinguish it from other competitors; but In-cell still has good yield and production. There is a big problem, there should be no chance to replace the external touch panel in the short term. Therefore, according to the current development view, small-size products may use In-cell touch; but large-size panels such as 13-inch or more using OGS or TOL (TouchOnLens) technology will be a better choice.
Brief introduction of the front and back process of OGS products
The OGS process is a glass mother substrate (Sheet) after metal wire coating (Sputter), black matrix (BlackMatrix, BM) indium tin oxide (ITO) process, and then through cutting (CutTIng) and grinding and carving process (Grinding / CNC ) Is a small substrate (Chip), and then use polishing grinding to trim the fine cracks on the edge of the glass.
In the first yellow light process of OGS, the yellow light process of BM will be performed first (Figure 2), and then the yellow light process of ITO and Al / Mo / Al will be carried out. The thickness of the metal layer (MetalLayer) is less than 4,000 (A). If dust particles occur ( ParTIcle, fiber, and poor metal film formation lead to defects in the conductive circuit, which will seriously affect the electrical properties of the product and cause the scrap to be shipped.
Figure 2 OGS product front-end process flow chart
The post-OGS process starts from cutting (Figure 3). After CNC edging, the product can be guided to avoid scratching or falling edge damage during the test. Then, the physical or chemical secondary strengthening process can be used. Increase the ability of its products to test at 4Point Bending. If it is chemically strengthened again, it will go through the site where the acid-resistant film is removed, and then enter the washing machine to remove the residual glue and excess hydrofluoric acid, then check whether there is a problem with the appearance, and finally to the printed circuit board (PCB) Lamination and electrical function testing, fill the BM process, and then paste the protective film on the front and back of the OGS product, then you can ship.
Figure 3 OGS product process flow chart
Observed from the current market trend, OGS has a tendency to approach large sizes, and touch products use strengthened glass, and the depth of strengthening and the price are both growing upwards, so the cost of OGS products will gradually increase, and the yield problem is particularly important, so how The effective use of glass in the front-end process to avoid scrapping is a problem that must be paid attention to by OGS production lines today.
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