[3 minutes in the evening]: Zhou Hongyi said that he can hijack every new car in Tesla; the world's top ten IC design companies 20

[Guide]: Zhou Hongyi said that he can hijack every new car of Tesla; China Mobile Chairman Shang Bing announced that it will accelerate the 5G business schedule; the world's top ten IC design companies ranked 201 Q1 revenue release; 5G first edition international standard Or completed in June; Intel released the OpenVINO toolkit, developers can build AI models on the Internet of Things; Tianhe No. 3 super-calculation prototype debut in Tianjin, etc., the following is the details.

Zhou Hongyi pours cold water for unmanned driving: Tesla can simulate hijacking every new car

On May 16th, the 2nd World Intelligence Conference was held in Tianjin. Zhou Hongyi, Chairman and CEO of 360 Group, said in a live speech that although he is also looking forward to the era of driverless driving, he wants to pour cold water on unmanned driving: Without security, there can be no real arrival in the era of smart cars.

Zhou Hongyi said that both Tesla and other smart cars can be controlled by mobile phones. They must be connected to the server of the depot. They can change the driving mode of the car by regularly updating the software. Since the cars can be connected to the Internet, the mobile phones can be used. Open the door and turn on the air conditioner, then you can be hijacked.

Zhou Hongyi claimed that the team researched by the company had already done a simulation of hijacking every time Tesla had a car. He laughed and said, "I don't have the idea of ​​everyone. The person who makes the shield must study the spear first."

At the meeting, Zhou Hongyi also said that he was a bit perverted. His understanding of himself was still very clear. From 360, Zhou Hongyi’s personality was seen.

China Mobile Chairman Shang Bing: Accelerating 5G Business Timetable

On May 17th, today is Telecom Day. For this special day, China Mobile Chairman Shang Bing delivered a speech.

Shang Bing said that with the accelerated maturity of artificial intelligence technology, the promotion of interconnection between people and human beings has gradually extended to human-computer interaction and the connection of objects and objects. The value of intelligent IoT services has become increasingly prominent, and applications in various industries and fields have gradually become popular. Give the connection driver a new meaning, and expand the new growth space for the basic telecommunications companies.

5G commercial timeline Xiaobian is also very concerned, let the network speed reach 10Gbps, who else is not expected?

The world's top ten IC design companies ranked 201 Q1 revenue, some people cried, some people laughed

According to the latest statistics of the TrendForce Research Institute of TrendForce, the world's top 10 IC design companies in the first quarter of 2018 revenue and ranking released, in addition to MediaTek and the company's revenue decline, the other eight manufacturers are Showing growth. Among them, Broadcom topped the list with $4.81 billion in revenue, up 15% year-on-year; while Qualcomm and NVIDIA followed closely with $3.897 billion and $2.79 billion in revenue, respectively. Second and third place.

This was followed by MediaTek ($1.694 billion), AMD ($1.647 billion), Xilinx ($673 million), Marvell ($605 million), Raychem Semiconductor ($362 million), and United Technologies ($357 million). ) and Dialog ($332 million).

Both Qualcomm and MediaTek's first-quarter revenue performance were not satisfactory. Qualcomm did not reach its target value, and MediaTek was crying for four consecutive years of decline. AMD and NVIDIA have benefited from the global mining excavation performance, and it is estimated that they are laughing in private.

"Ali Department" Zhongtianwei cooperates with the new three board Guangzhou Yurun to study the Internet of Things technology

Not long ago, the chip company acquired by Ali has a new move, and signed a strategic cooperation agreement with the new three board listed company Guangzhou Yurun NB-IoT IoT application.

The two sides will conduct research on IoT technologies with low power consumption, wide coverage, low cost and large capacity, and promote the batch application, technology standardization and industry alliance of NB-IoT modules to provide convenient and safe services for industry users. The module is mainly used in smart cities, smart fire, smart home and other industries.

Announced that after establishing a strategic partnership, Zhongtianwei will provide technical support for Guangzhou Yurun in the NB-IoT field. Guangzhou Haorun will use its product advantages and channel advantages to enter the NB-IoT module design and customization field. Provide a full range of NB-IoT IoT modules and application solutions for smart cities, smart fire protection, smart homes and other industries.

The 5G first edition international standard was completed in June, and the two-year battle ended.

The 5G standard voting event has caused Lenovo to engage in a war of words. However, the two votes in 2016 have not yet decided on the 5G standard. The 5G first edition international standard will be completed in June this year.

Xinhua News Agency reported that the "voting" organized by 3GPP will eventually be a technical transformation and upgrade. At the same time, it will also consider a big problem. Liu Du, the representative of the National People's Congress of China and the director of China Information and Communication Research Institute, pointed out that the first edition of 5G is expected. International standards will be completed in June this year.

3GPP is an industry association with strong influence in the global communication field. It was established in December 1998. Its main members include ETSI in Europe, ARIB and TTC in Japan, and CCSA in mainland China. The scope covers almost the whole industry and acts in the industry. The status of “coordinating member conflicts, designating new regulations and agreements”. The influence has continued from the 2G era to today's 4G.

There are naturally interests behind the technology. LDPC technology represents companies including Qualcomm and Samsung. Polar technology representatives are some mainland companies including Huawei. Turbo2.0 technology represents companies in some European countries including France.

Intel released the OpenVINO toolkit, which allows developers to build AI models on the Internet of Things.

On May 16, Intel introduced the OpenVINO toolkit, which integrates computer graphics and deep learning inference into cutting-edge vision applications.

The OpenVINO (Open Visual Reasoning and Neural Network Optimization) toolkit enables developers to create and train AI models based on the cloud (such as the popular TensorFlow, MXNet, and Caffe frameworks) and deploy them to a variety of products.

Intel said that OpenVINO is suitable for many applications. For example, in a retail environment, developers may want to deploy computer vision features in a range of edge applications, including point of sale, digital signage, and security cameras.

Chongqing wants fire, will build SK Hynix's largest packaging and testing base in the world

According to the news on the 17th of the new network, SK Hynix Semiconductor (Chongqing) Co., Ltd. Chairman Wu Zaisheng revealed on the 17th that the semiconductor storage industry giant South Korea SK Hynix's Chongqing plant will build a second phase of the project, becoming the company's largest package testing base in the world.

The first phase of the Chongqing plant was put into operation in 2014 and currently has a monthly capacity of 80 million chips.

The investment in the second phase of the Chongqing plant is not less than US$1 billion. The contract was finalized this month. It is expected to start in the first half of 2018 and put into production in 2019. Wu Zaisheng said that after the project is put into production, the combined capacity of the first and second phases will be 1.5 times the current capacity. By then, Chongqing factory products will account for the total number of SK Hynix flash memory products, from the current 30% to 40%, becoming the company's largest packaging test base in the world.

Tianhe No. 3 super-calculation prototype appeared in Tianjin, bid farewell to Intel to achieve full autonomy of the chip

At the 2nd World Intelligence Conference held in Tianjin on May 16-18, the “Tianhe No.3” super-calculation prototype that had just been developed was debuted. Say goodbye to the previous generation of Intel chips, the "Tianhe No.3" prototype uses the independent Feiteng processor, Tianhe high-speed interconnect communication and Kirin operating system to achieve the national production of the chip.

The new generation of billions of (E-class) super-calculation "Tianhe No.3" development project is still in the process of application, and is carried out by the Super-Tianjin Center United Nations University of Science and Technology. The target performance of “Tianhe No.3” will be more than ten times higher than that of “Tianhe No.2”.

"Tianhe No. 2" using Intel Xeon Phi processor has won the global supercomputer list for six consecutive years, and can perform N-dimensional numerical simulation of neutrino and dark matter cosmology of 3 trillion particles, revealing 1600 after the Big Bang. The history of 13.7 billion years from the year to the present.

In 2017, the “Shenwei Taihu Light”, which was independently developed by the “Shenwei 26010” multi-core processor, was replaced by “Tianhe No. 2”.

Electronic enthusiasts will hold the China Internet of Things Conference in Shenzhen on December 6, 2018. Please pay attention to the electronics engineers concerned with the Internet of Things, smart cars, smart cities, smart agriculture, smart homes, NB-IoT and other hotspots. Our assembly. You can click to go to the details.

The China IoT Conference was held by Huaqiang Jufeng's Million Electronics Engineer Platform Electronic Enthusiasts Network. The conference has been successfully held for 4 sessions. In the form of “Grand Forum + Sub-Forum”, 100+ global famous manufacturers have been gathered to successfully attract 6,000+. The names of electronic semiconductor practitioners signed up for the event, affecting 200,000+ electronic engineers.

We are committed to guiding China's IoT wind vane, gathering global IoT industry leaders, analyzing the potential market value of various industries, exposing the latest technology solutions, providing the best communication platform, and striving to build an IoT ecosystem with many partners.

Time: December 6-7, 2018

Location: Shenzhen, China

Expected size: 2,000+


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